Title:
SUBSTRATE COATING DEVICE AND SUBSTRATE COATING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/042738
Kind Code:
A1
Abstract:
The present invention relates to a substrate coating technology that coats a substrate (W) with a processing liquid by discharging the processing liquid from a slit nozzle (2) while moving the slit nozzle relative to the substrate. A termination coating speed is defined as the coating speed when a discharge port of the slit nozzle passes above a termination region of a substrate in a coating direction, and a pre-termination coating speed is defined as the coating speed when the discharge port passes above a pre-termination region located on the upstream side of the termination region in the coating direction. In doing so, the termination coating speed is increased more than the pre-termination coating speed in the present invention. Thus, the meniscus of the processing liquid formed between the discharge port and the substrate at the termination region is coated at an ideal film thickness, and excess supplying of the processing liquid at the termination region is prevented.
Inventors:
ABE YUJI (JP)
Application Number:
PCT/JP2022/033682
Publication Date:
March 23, 2023
Filing Date:
September 08, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
B05C11/10; B05C5/02; B05D1/26; B05D3/00; H01L21/027
Foreign References:
| JP2004063795A | 2004-02-26 | |||
| JP2010058097A | 2010-03-18 | |||
| JP2003190863A | 2003-07-08 | |||
| JP2015091569A | 2015-05-14 |
Attorney, Agent or Firm:
FURIKADO, Shoichi et al. (JP)
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