Title:
SUBSTRATE CONNECTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/221176
Kind Code:
A1
Abstract:
Provided is a substrate connector device with which it is possible to omit a sealing structure between a connector part and a case, without requiring a complex metal structure. A substrate connector device (10) comprises: a case (20) accommodating a circuit board (90), the case having an integrated hood-shaped connector part (22) that opens to the outside and can engage with a mating housing (70), and the case (20) having on the inner side a demarcating part (25) that demarcates an assembly space (24) connected to the interior of the connector part (22); a terminal fitting (60) having a substrate connection part (66) and a mating connection part (64); and a block part (40) that surrounds and holds in resin a part of the mating connection part (64) of the terminal fitting (60), is assembled in the assembly space (24), and is positioned and held by the demarcating part (25).
Inventors:
FURUTANI MITSUGU (JP)
Application Number:
PCT/JP2018/018479
Publication Date:
December 06, 2018
Filing Date:
May 14, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01R13/514
Foreign References:
| JP2009176570A | 2009-08-06 | |||
| JP2016058357A | 2016-04-21 | |||
| JP2016213180A | 2016-12-15 | |||
| JP2012099274A | 2012-05-24 |
Attorney, Agent or Firm:
GRANDOM PATENT LAW FIRM (JP)
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