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Title:
SUBSTRATE DELIVERY DEVICE, SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/121625
Kind Code:
A1
Abstract:
A substrate delivery device comprises a substrate supplying section for feeding a substrate in a certain direction, a substrate recovery section for winding the substrate fed from the substrate supplying section, a stage having a guiding surface for guiding the underside of the substrate, and a displacement mechanism for causing at least a part of the substrate guided on the guiding surface to be displaced in a direction orthogonal to the guiding surface.

Inventors:
HORI MASAKAZU (JP)
NISHIKAWA JIN (JP)
Application Number:
PCT/JP2012/076765
Publication Date:
August 22, 2013
Filing Date:
October 17, 2012
Export Citation:
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Assignee:
NIKON CORP (JP)
International Classes:
B65H23/24; G03F7/20; G09F9/00; H01L21/027
Foreign References:
JPH11102077A1999-04-13
JP2010271603A2010-12-02
JP2011203311A2011-10-13
JP2009221515A2009-10-01
JP2011022585A2011-02-03
JP2010272606A2010-12-02
JP2004161424A2004-06-10
JP2005030499A2005-02-03
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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Claims:



 
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