Title:
SUBSTRATE DEVICE AND METHOD FOR PRODUCING SUBSTRATE DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/090460
Kind Code:
A1
Abstract:
The present disclosure pertains to a substrate device and a method for producing the substrate device, capable of improving reliability and the produced quality of the substrate device as electronic hardware. According to the present invention, a plurality of sheet-like substrates in which wiring patterns are formed are stacked on one another to form a single-piece substrate having internal wiring, whereby two substrates are connected both physically and electrically. The disclosure is applicable to a substrate device.
More Like This:
| JP3728375 | RELAY BOARD AND MANUFACTURE THEREOF |
| JPH0212988 | CONNECTING METHOD FOR FLEXIBLE PRINTED CIRCUIT |
| JP2008166485 | MODULE |
Inventors:
NOMURA YOSHIYUKI (JP)
Application Number:
PCT/JP2016/083476
Publication Date:
June 01, 2017
Filing Date:
November 11, 2016
Export Citation:
Assignee:
SONY CORP (JP)
International Classes:
H05K1/14
Foreign References:
| DE102007046493A1 | 2009-04-09 | |||
| JPH08195540A | 1996-07-30 | |||
| US7005584B2 | 2006-02-28 | |||
| JP2005005092A | 2005-01-06 | |||
| JPS56106471U | 1981-08-19 |
Attorney, Agent or Firm:
NISHIKAWA Takashi et al. (JP)
Download PDF: