Title:
SUBSTRATE DIVISION DETECTION DEVICE AND SUBSTRATE DIVISION DETECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2022/045077
Kind Code:
A1
Abstract:
Provided are a substrate division detection device and a substrate division detection method that, after dividing a substrate in a state held on a holding film into a plurality of chip materials, can detect and assess for each dividing line whether the substrate in the state held on the holding film is reliably divided into chip materials. The present invention is a device (3) that, after a substrate (1) in a state held on a holding film (9) is divided into a plurality of chip materials (2), detects the division success or failure of the substrate, and has: an extrusion member (4) that is deployed to face one main surface of the substrate, and extrudes chip materials divided into a plurality from one main surface; an illumination means (5) that is deployed to face the other main surface of the substrate, and irradiates an illumination light (IL) on the extruded chip materials (2); an imaging means (6) that is deployed to the other main surface side of the substrate, and that captures the reflected light (SL) reflected on the extruded chip materials; and a division detection means (7) that detects division success or failure of the substrate using the image captured by the imaging means.
Inventors:
KANEHIRA YUICHI (JP)
MITANI TAKURO (JP)
TSUTSUMI TAKASHI (JP)
KOBATA RYOSUKE (JP)
HIDESHIMA MAMORU (JP)
MITANI TAKURO (JP)
TSUTSUMI TAKASHI (JP)
KOBATA RYOSUKE (JP)
HIDESHIMA MAMORU (JP)
Application Number:
PCT/JP2021/030848
Publication Date:
March 03, 2022
Filing Date:
August 23, 2021
Export Citation:
Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
International Classes:
H01L21/301
Foreign References:
| JP2013149932A | 2013-08-01 | |||
| JP2010045252A | 2010-02-25 | |||
| JP2017013255A | 2017-01-19 |
Attorney, Agent or Firm:
YASUDA & OKAMOTO PATENT ATTORNEYS (JP)
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