Title:
SUBSTRATE-EDGE GRINDING METHOD, AND SUBSTRATE-EDGE GRINDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/002447
Kind Code:
A1
Abstract:
A substrate-edge grinding method includes: a first step (S1) in which a flat grinding wheel is used to grind edges of a bonded substrate obtained by bonding together a plurality of substrates; and a second step (S2, S3) in which a formed grinding wheel is used to bevel both ends of the bonded-substrate edges grinded by the flat grinding wheel, said ends being in the width direction of the bonded substrate.
Inventors:
MITSUHASHI AKIHIRO
SAKAI SHOHICHI
OHSHIMA HIDEKAZU
KOJIMA HIROAKI
SATOH SEIJI
SAKAI SHOHICHI
OHSHIMA HIDEKAZU
KOJIMA HIROAKI
SATOH SEIJI
Application Number:
PCT/JP2013/003866
Publication Date:
January 03, 2014
Filing Date:
June 20, 2013
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
B24B9/00; B24B9/10
Domestic Patent References:
| WO2012077645A1 | 2012-06-14 |
Foreign References:
| JPH081493A | 1996-01-09 | |||
| JPH06190700A | 1994-07-12 |
Attorney, Agent or Firm:
MAEDA & PARTNERS (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
Patent business corporation MAEDA PATENT OFFICE (JP)
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