SUBSTRATE AND ELECTRONIC APPARATUS

Title:

SUBSTRATE AND ELECTRONIC APPARATUS

Document Type and Number:

WIPO Patent Application WO/2020/129171

Kind Code:

A1

Abstract:

[Problem] To propose an exemplary technique for controlling impedance accurately. [Solution] Provided is a substrate comprising: a first through-hole penetrating through the substrate from a first surface to a second surface and electrically connected to a transmission line through which a signal is transmitted; a second through-hole disposed adjacent to the first through-hole in a plan view of the substrate, penetrating through the substrate from the first surface to the second surface, and electrically connected to a ground; and an adjusting portion which adjusts the impedance of an end of the first through-hole connected with the transmission line by adjusting the distance between the first through-hole and the second through-hole in a plan view of the substrate.

Inventors:

SHINOJIMA TAKAHIRO (JP)

Application Number:

PCT/JP2018/046726

Publication Date:

June 25, 2020

Filing Date:

December 19, 2018

Export Citation:

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Assignee:

SONY CORP (JP)

International Classes:

H05K1/11; H01P1/04; H01P5/08; H05K3/46

Domestic Patent References:

WO2004107830A1

2004-12-09

Foreign References:

JP2007250885A	2007-09-27
JP2008205099A	2008-09-04
JP2012129350A	2012-07-05

Other References: