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Title:
SUBSTRATE FIXING STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2024/034578
Kind Code:
A1
Abstract:
This substrate fixing structure secures, to a fixing destination member, a substrate comprising a heating component on a first surface so that a second surface faces the fixing destination member side. A first spacer is disposed between the second surface of the substrate and the fixing destination member. A metal screw is inserted into a substrate hole provided in the substrate, and thus, a leading end section thereof is mounted on the fixing destination member. The screw sandwiches the substrate and the first spacer between the fixing destination member and a screw head section. A rear surface of a flange portion of the screw head section is in contact with the heating component.

Inventors:
NAKAMURA TAKUYA (JP)
Application Number:
PCT/JP2023/028798
Publication Date:
February 15, 2024
Filing Date:
August 07, 2023
Export Citation:
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Assignee:
IHI CORP (JP)
International Classes:
H05K7/20; H01L23/40; H05K7/14
Domestic Patent References:
WO2020003423A12020-01-02
Foreign References:
JPH04113695A1992-04-15
JPH1050046A1998-02-20
JP2004071006A2004-03-04
JP2016040806A2016-03-24
US4756081A1988-07-12
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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