SUBSTRATE FOR FLEXIBLE DEVICES - TOYO SEIKAN GROUP HOLDINGS LTD

Title:

SUBSTRATE FOR FLEXIBLE DEVICES

Document Type and Number:

WIPO Patent Application WO/2018/235759

Kind Code:

A1

Abstract:

The present invention provides a substrate for flexible devices, which has excellent bending resistance and excellent surface smoothness of a glass layer surface, while exhibiting excellent antirust properties, moisture barrier properties and adhesion of a glass layer. This substrate for flexible devices is characterized by comprising: a stainless steel base material; a nickel plating layer that is formed on the surface of the stainless steel base material; and a glass layer that is formed on the surface of the nickel plating layer in the form of a bismuth glass layer having electrical insulating properties.

More Like This:

JP2017531318	Flexible light emitting device
JP4677817	Organic EL equipment, manufacturing methods for organic EL equipment, and electronic devices using these
WO/2022/202771	FILM-LAMINATED METAL SHEET, METHOD FOR MANUFACTURING SAME, SUBSTRATE FOR FLEXIBLE ELECTRONICS, AND ORGANIC EL SUBSTRATE

Inventors:

NANBU KOUJI (JP)
MIYAZAKI TOSHIHIKO (JP)
MASUDA HIROHISA (JP)
SHIMOMURA HIROSHI (JP)

Application Number:

PCT/JP2018/023059

Publication Date:

December 27, 2018

Filing Date:

June 18, 2018

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TOYO SEIKAN GROUP HOLDINGS LTD (JP)

International Classes:

H05B33/02; B32B15/04; C03C8/16; C23C8/12; C23C28/00; H01L51/50; H05B33/04

Foreign References:

JP2014107053A	2014-06-09
JP2011126722A	2011-06-30
JP2012041196A	2012-03-01
JP2004171806A	2004-06-17
JP2011097007A	2011-05-12
JP2006080370A	2006-03-23
JP2014107053A	2014-06-09

Other References: