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Patent Searching and Data


Title:
SUBSTRATE HAVING METAL NANOWIRE LAYER FORMED THEREON AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2017/159698
Kind Code:
A1
Abstract:
Provided is a substrate having a metal nanowire layer formed thereon, the metal nanowire layer having high durability against migration or sulfurization/oxidation and high mechanical strength, wherein some of the metal nanowires are embedded in a flexible substrate by forming the metal nanowire layer on the substrate and applying external energy, and some or all of the exposed metal nanowires are plated.

Inventors:
ARAKI TEPPEI (JP)
SEKITANI TSUYOSHI (JP)
SUGANUMA KATSUAKI (JP)
JIU JINTING (JP)
OHATA HIDEKI (JP)
UCHIDA HIROSHI (JP)
HARA MASANAO (JP)
NAKAZAWA ERI (JP)
Application Number:
PCT/JP2017/010264
Publication Date:
September 21, 2017
Filing Date:
March 14, 2017
Export Citation:
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Assignee:
UNIV OSAKA (JP)
SHOWA DENKO KK (JP)
International Classes:
H01B5/14; B32B5/16; B32B15/02; B32B15/08; B32B27/12; B82Y30/00; B82Y40/00; H01B13/00
Foreign References:
JP2012527071A2012-11-01
JP2013522814A2013-06-13
JP2016509332A2016-03-24
Attorney, Agent or Firm:
ARIHARA Motoji (JP)
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