Title:
SUBSTRATE HEAT PROCESSING DEVICE AND SUBSTRATE HEAT PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/008831
Kind Code:
A1
Abstract:
According to the present invention, a plurality of exhaust ducts (29) are distributed and disposed over the entire surface of a substrate (W) when viewed in a plan view, whereby the gas of a processing atmosphere (pa) is exhausted from locations distributed over the entire surface of a substrate (W) when viewed in a plan view. Therefore, the distance from the inert gas supplied to the processing atmosphere (pa) to any of the exhaust ducts (29) can be shorter than that in prior arts, whereby the flow of the inert gas on the surface of the substrate (W) is stable and unevenness in the flow of the inert gas can be suppressed. Thus, a film to be coated is not adversely affected and uniformity of the film thickness can be improved.
Inventors:
OKAMOTO DAIKI (JP)
SHIBA YASUHIRO (JP)
WAJIKI TAKEHIRO (JP)
SHIBA YASUHIRO (JP)
WAJIKI TAKEHIRO (JP)
Application Number:
PCT/JP2019/023477
Publication Date:
January 09, 2020
Filing Date:
June 13, 2019
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; H01L21/304
Foreign References:
| JP2003158061A | 2003-05-30 | |||
| JP2003234270A | 2003-08-22 | |||
| JP2005064277A | 2005-03-10 | |||
| JP2010028133A | 2010-02-04 | |||
| JPH0340418A | 1991-02-21 |
Attorney, Agent or Firm:
SUGITANI Tsutomu (JP)
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