Title:
SUBSTRATE FOR HIGH-FREQUENCY DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/259896
Kind Code:
A1
Abstract:
Provided is a substrate for a high-frequency device that satisfies the requirements of having a low dielectric loss tangent, being adhesive, and being transparent. The substrate for a high-frequency device has a transparent glass substrate 16 and a transparent resin substrate 20 that is bonded to the glass substrate 16 via an optical transparent adhesive agent 18. The resin substrate 20 has a dielectric loss tangent of 0.01 or less in dielectric loss tangent measurement tests, a peeling force of 3.0 N/cm or greater in a peeling test, and an outgas volume of 5.0 μg/g or less in an outgas test.
Inventors:
OKUDA RYOTA (JP)
KAKIUCHI TOSHIFUMI (JP)
KAKIUCHI TOSHIFUMI (JP)
Application Number:
PCT/JP2022/021930
Publication Date:
December 15, 2022
Filing Date:
May 30, 2022
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B17/10; H01Q1/38; H05K1/03
Domestic Patent References:
| WO2020181558A1 | 2020-09-17 | |||
| WO2020100834A1 | 2020-05-22 |
Foreign References:
| JP2015160326A | 2015-09-07 | |||
| JP2020029399A | 2020-02-27 | |||
| JP2021095543A | 2021-06-24 |
Attorney, Agent or Firm:
T.S. PARTNERS et al. (JP)
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