Title:
SUBSTRATE HOLDER, SUBSTRATE BONDING DEVICE, AND SUBSTRATE BONDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/226152
Kind Code:
A1
Abstract:
This substrate holder is provided with a central support portion for supporting a central portion of a substrate, and an outer peripheral support portion provided on the outside of the central support portion to support an outer peripheral portion on the outside of the central portion. The outer peripheral support portion supports the outer peripheral portion so that at least a partial region of the outer peripheral portion curves toward the substrate holder with a greater curvature than that of the central portion.
Inventors:
MITSUISHI HAJIME (JP)
SUGAYA ISAO (JP)
KAMASHITA ATSUSHI (JP)
OKADA MASASHI (JP)
FUKUDA MINORU (JP)
MAEDA HIDEHIRO (JP)
SUGAYA ISAO (JP)
KAMASHITA ATSUSHI (JP)
OKADA MASASHI (JP)
FUKUDA MINORU (JP)
MAEDA HIDEHIRO (JP)
Application Number:
PCT/JP2020/018522
Publication Date:
November 12, 2020
Filing Date:
May 07, 2020
Export Citation:
Assignee:
NIKON CORP (JP)
International Classes:
H01L21/02; H01L21/673; H01L21/683
Domestic Patent References:
| WO2017217431A1 | 2017-12-21 |
Foreign References:
| JPH0494735U | 1992-08-17 | |||
| JP2012222284A | 2012-11-12 | |||
| JP2018026414A | 2018-02-15 | |||
| JP2009064827A | 2009-03-26 | |||
| JP2008172159A | 2008-07-24 | |||
| US20180090348A1 | 2018-03-29 | |||
| JP2018026573A | 2018-02-15 |
Attorney, Agent or Firm:
RYUKA IP LAW FIRM (JP)
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