Title:
SUBSTRATE JOINING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/079582
Kind Code:
A1
Abstract:
Provided is a substrate joining method that includes the following: a step for causing metal layers (12, 22), that are fff ormed on a plurality of substrates (10, 20) respectively, to face each other with a porous body (32) comprising a first metal (35) interposed therebetween; a step for replacing the first metal that is on the surface of the porous body with a second metal (36); and a step for joining the metal layers by heating the second metal.
Inventors:
IMAIZUMI NOBUHIRO (JP)
Application Number:
PCT/JP2013/082267
Publication Date:
June 04, 2015
Filing Date:
November 29, 2013
Export Citation:
Assignee:
FUJITSU LTD (JP)
International Classes:
B23K1/008; B23K1/00; B23K3/00
Domestic Patent References:
| WO2013069798A1 | 2013-05-16 |
Foreign References:
| JPH0536306A | 1993-02-12 | |||
| JP2008172215A | 2008-07-24 |
Attorney, Agent or Firm:
KATAYAMA, SHUHEI (JP)
Shuhei Katayama (JP)
Shuhei Katayama (JP)
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