SUBSTRATE LAMINATE, AND IMAGING DEVICE

Title:

SUBSTRATE LAMINATE, AND IMAGING DEVICE

Document Type and Number:

WIPO Patent Application WO/2019/077990

Kind Code:

A1

Abstract:

This substrate laminate is provided with: an imaging element mounting substrate for mounting an imaging element; and a flexible wiring circuit board which is capable of being electrically connected to an actuator module, and which is electrically connected to the imaging element mounting substrate. The imaging element mounting substrate is provided with metal wiring. The thickness of the metal wiring is 12 µm or lower. The total thickness of the imaging element mounting substrate is 60 µm or lower. A portion of the flexible wiring circuit board is provided in a region of the imaging element mounting substrate other than a mounting region where the imaging element is mounted.

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Inventors:

SHIBATA SHUSAKU (JP)
HARUTA HIROMOTO (JP)
WAKAKI SHUICHI (JP)

Application Number:

PCT/JP2018/036783

Publication Date:

April 25, 2019

Filing Date:

October 02, 2018

Export Citation:

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Assignee:

NITTO DENKO CORP (JP)

International Classes:

H04N5/225; H01L23/12; H01L25/00; H05K1/14

Domestic Patent References:

WO2015104960A1	2015-07-16
WO2014174943A1	2014-10-30

Foreign References:

JP2008312104A	2008-12-25
JP2015038908A	2015-02-26

Attorney, Agent or Firm:

OKAMOTO, Hiroyuki et al. (JP)

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