Title:
SUBSTRATE LAYERED BODY MANUFACTURING METHOD AND SUBSTRATE LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2024/010007
Kind Code:
A1
Abstract:
This substrate layered body manufacturing method includes: a step A for preparing a first layered body in which a first resin layer, a first substrate, and a first organic material layer are layered in that order, the first resin layer is disposed on one surface, and the first inorganic material layer is disposed on the other surface, and a second layered body in which a second resin layer, a second substrate, and a second inorganic material layer are layered in that order, the second resin layer is disposed on one surface, and the second inorganic material layer is disposed on the other surface; a step B for layering the first layered body and the second layered body by bringing into contact the first resin layer of the first layered body and the second inorganic material layer of the second layered body; and a step C for heating the first layered body and the second layered body at 100°C or higher after said step B.
Inventors:
INADA SATOSHI (JP)
KAYABA YASUHISA (JP)
NAKAMURA YUZO (JP)
KAYABA YASUHISA (JP)
NAKAMURA YUZO (JP)
Application Number:
PCT/JP2023/024825
Publication Date:
January 11, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
H01L21/02; B32B9/00; B32B37/00; H01L25/065; H01L25/07; H01L25/18
Foreign References:
| US20210320086A1 | 2021-10-14 | |||
| JP2021182621A | 2021-11-25 | |||
| JP2017124586A | 2017-07-20 | |||
| JP2016062951A | 2016-04-25 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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