Title:
SUBSTRATE FOR LED AND LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2006/129690
Kind Code:
A1
Abstract:
Disclosed is an easily manufacturable substrate for LEDs having excellent heat-dissipating properties. Also disclosed is an LED package using such a substrate for LEDs. Specifically disclosed is a substrate (1) for LEDs wherein an insulating layer (11) provided with an LED mounting hole (14) is bonded to a flat surface of a heat-dissipating unit (10) and a wiring unit (12) having a wiring pattern is formed on the insulating layer (11). Also specifically disclosed is an LED package (2) wherein an LED chip (20) is mounted on the heat-dissipating unit (10) in the LED mounting hole (14) of the substrate (1) for LEDs and the LED chip (20) is electrically connected to the wiring unit (12).
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Inventors:
KAWAOTO SHIGENOBU (JP)
SHIMOMURA AKIRA (JP)
NISHIZAWA KAZUYOSHI (JP)
YAMAUCHI SHINOBU (JP)
MIZO TATSUHIRO (JP)
KIMURA KAZUO (JP)
SHIMOMURA AKIRA (JP)
NISHIZAWA KAZUYOSHI (JP)
YAMAUCHI SHINOBU (JP)
MIZO TATSUHIRO (JP)
KIMURA KAZUO (JP)
Application Number:
PCT/JP2006/310845
Publication Date:
December 07, 2006
Filing Date:
May 31, 2006
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
KAWAOTO SHIGENOBU (JP)
SHIMOMURA AKIRA (JP)
NISHIZAWA KAZUYOSHI (JP)
YAMAUCHI SHINOBU (JP)
MIZO TATSUHIRO (JP)
KIMURA KAZUO (JP)
KAWAOTO SHIGENOBU (JP)
SHIMOMURA AKIRA (JP)
NISHIZAWA KAZUYOSHI (JP)
YAMAUCHI SHINOBU (JP)
MIZO TATSUHIRO (JP)
KIMURA KAZUO (JP)
International Classes:
H01L33/56; H01L33/60; H01L33/62; H01L33/64
Foreign References:
| JP2004265986A | 2004-09-24 | |||
| JP2004228413A | 2004-08-12 | |||
| JP2006005290A | 2006-01-05 | |||
| JP2004356213A | 2004-12-16 |
Attorney, Agent or Firm:
Shimizu, Hisayoshi (4-26 Minamisemba 3-chome,, Chuo-ku, Osaka-sh, Osaka, JP)
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