Title:
SUBSTRATE LIQUID TREATMENT METHOD AND SUBSTRATE LIQUID TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/060037
Kind Code:
A1
Abstract:
A substrate comprising a recessed portion, a diffusion barrier layer that divides the recessed portion, and wiring exposed on a bottom portion of the recessed portion is prepared. Metal ions having a concentration that does not cause metal to be deposited when an electroless plating solution is brought into contact therewith are attached to the diffusion barrier layer. The electroless plating solution is supplied to the recessed portion while the metal ions are attached to the diffusion barrier layer so that metal is deposited on the recessed portion.
Inventors:
IWASHITA MITSUAKI (JP)
Application Number:
PCT/JP2020/034626
Publication Date:
April 01, 2021
Filing Date:
September 14, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/288; C23C18/18; C23C18/31; H01L21/768
Foreign References:
| JP2006513325A | 2006-04-20 | |||
| JP2002110784A | 2002-04-12 | |||
| JP2001015517A | 2001-01-19 | |||
| JP2014099627A | 2014-05-29 | |||
| JP2010503204A | 2010-01-28 | |||
| JP2014122391A | 2014-07-03 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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