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Patent Searching and Data


Title:
SUBSTRATE RAISING/LOWERING MODULE, SUBSTRATE PROCESSING MODULE INCLUDING SAME, AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/071693
Kind Code:
A1
Abstract:
The present invention relates to a substrate raising/lowering module, a substrate processing module including same, and a substrate processing system. Disclosed is a raising/lowering module (200) characterized by comprising: a substrate support part (210) located in the inner space (S) of a chamber (21) and supporting a substrate (G); and a vertical driving part (220) that is coupled to the substrate support part (210) and drives the up and down movement of the substrate support part (210). The vertical driving part (220) includes: a shaft (222) coupled to the substrate support part (210) and extending outward through the chamber (21); and a rotation prevention part (228) coupled to the shaft (222) to prevent circumferential rotation about the longitudinal reference axis of the shaft (222).

Inventors:
CHO JAE HYUN (KR)
Application Number:
PCT/KR2023/012568
Publication Date:
April 04, 2024
Filing Date:
August 24, 2023
Export Citation:
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Assignee:
PRESYS CO LTD (KR)
International Classes:
H01L21/687; H01L21/67
Foreign References:
KR20160141244A2016-12-08
JP2013106009A2013-05-30
KR20170091215A2017-08-09
KR200460437Y12012-05-25
KR20180051914A2018-05-17
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
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