Title:
SUBSTRATE, PACKAGING STRUCTURE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/213195
Kind Code:
A1
Abstract:
Provided in the embodiments of the present application are a substrate, a packaging structure and an electronic device. According to the substrate provided in the embodiments of the present application, since an inductor is arranged in a recess of the substrate, and the distance between the inductor and a pad for connecting a chip is relatively small, a connecting line between the inductor and the pad is relatively short, such that the eddy-current loss of the connecting line between the inductor and the pad is less; in addition, the structure in which the inductor is placed in an internal recess of the substrate can fully use the internal space of the substrate, such that the use of the surface area of the substrate is reduced, and thus the packaging size can be reduced to a certain extent.
Inventors:
YAO CHENG (CN)
JIANG FAN (CN)
WU YANHONG (CN)
YANG MIN (CN)
LIN YONGJIA (CN)
JIANG FAN (CN)
WU YANHONG (CN)
YANG MIN (CN)
LIN YONGJIA (CN)
Application Number:
PCT/CN2023/089591
Publication Date:
November 09, 2023
Filing Date:
April 20, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H05K1/16; H01F17/00; H01F17/06
Foreign References:
| CN104486905A | 2015-04-01 | |||
| US20190287815A1 | 2019-09-19 | |||
| CN110581219A | 2019-12-17 | |||
| CN106332447A | 2017-01-11 | |||
| CN106133904A | 2016-11-16 |
Attorney, Agent or Firm:
BEIJING ZBSD PATENT & TRADEMARK AGENT LTD. (CN)
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