Title:
SUBSTRATE POLISHING DEVICE AND METHOD FOR DISCHARGING POLISHING FLUID IN SUBSTRATE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/039419
Kind Code:
A1
Abstract:
In a substrate polishing device in which a polishing fluid passes through the inside of a rotary joint, maintenance of the rotary joint is required. Disclosed is a substrate polishing device having: a polishing head for holding a substrate; a rotary table provided with a first opening on a surface thereof; a polishing fluid discharge mechanism provided on the rotary table; and a control unit for controlling at least the polishing fluid discharge mechanism. The substrate polishing device has a first cylinder, a first piston, and a driving mechanism for driving the first piston. The first opening communicates with a fluid retaining space defined by the first cylinder and the first piston. The control unit controls the operation of the first piston by means of the driving mechanism so as to increase/decrease the volume of the fluid retaining space.
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Inventors:
TOGAWA TETSUJI (JP)
KOBAYASHI KENICHI (JP)
KOBAYASHI KENICHI (JP)
Application Number:
PCT/JP2018/030613
Publication Date:
February 28, 2019
Filing Date:
August 20, 2018
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/00; B24B7/04; B24B47/26; B24B55/06; H01L21/304
Foreign References:
| KR20060070657A | 2006-06-26 | |||
| JP2004082270A | 2004-03-18 | |||
| JP2001105301A | 2001-04-17 | |||
| JP2017013196A | 2017-01-19 | |||
| JP2005217002A | 2005-08-11 | |||
| JPH03198332A | 1991-08-29 | |||
| JP2007118119A | 2007-05-17 |
Attorney, Agent or Firm:
ONO, Shinjiro et al. (JP)
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