Title:
SUBSTRATE FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/189744
Kind Code:
A1
Abstract:
In the present invention, a substrate for a printed wiring board comprises: a base film having a first main surface and a second main surface; a first electrically conductive layer disposed on the first main surface; a second electrically conductive layer disposed on the second main surface; a first electroless copper plating layer disposed on the first electrically conductive layer; a second electroless copper plating layer disposed on the second electrically conductive layer; and a third electroless copper plating layer. A through-hole penetrating through the base film along the thickness direction is formed in the base film. The third electroless copper plating layer is disposed on the inner wall surface of the through hole. The palladium content of the base film in the first main surface and the second main surface is smaller than palladium content of the base film in the inner wall surface.
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| JPS6431494 | CONNECTING STRUCTURE OF SUBSTRATE EQUIPPED WITH MICROSTRIP LINE |
| WO/2008/023405 | FLEXIBLE PRINTED BOARD |
Inventors:
HIDANI TAKUTO (JP)
MIKAGE KATSUNARI (JP)
IMAKITA KENTA (JP)
MIKAGE KATSUNARI (JP)
IMAKITA KENTA (JP)
Application Number:
PCT/JP2023/010643
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K1/11; H05K3/18; H05K3/24; H05K3/42
Foreign References:
| JPH03201592A | 1991-09-03 | |||
| JP2016058545A | 2016-04-21 | |||
| JP2003158364A | 2003-05-30 | |||
| JP2017098422A | 2017-06-01 | |||
| JP2019197851A | 2019-11-14 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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