Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/055855
Kind Code:
A1
Abstract:
A substrate processing apparatus processes end sections (61a, 61b) of a film surface (61) of a substrate to be processed (60) having a substrate (62) and the film surface (61) provided on the substrate (62). The substrate processing apparatus is provided with: a sucking/holding section (10) which sucks and holds the substrate to be processed (60) from above in a state where the substrate (62) is positioned above the film surface (61); a laser irradiation apparatus (20) which radiates a laser beam (L); and a laser moving section (22) which moves the laser irradiation apparatus (20) in the horizontal direction. The end sections (61a, 61b) of the film surface (61) of the substrate to be processed (60), which is held by means of the sucking/holding section (10), are processed by moving the laser irradiation apparatus (20), while radiating the laser beam (L) from the laser irradiation apparatus (20).
Inventors:
KANBE HIROHISA (JP)
Application Number:
PCT/JP2009/069202
Publication Date:
May 20, 2010
Filing Date:
November 11, 2009
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
KANBE HIROHISA (JP)
KANBE HIROHISA (JP)
International Classes:
H01L21/304; B23K26/00; B23K26/08; B23K26/10; H01L31/04
Foreign References:
| JP2003197570A | 2003-07-11 | |||
| JPH10189515A | 1998-07-21 | |||
| JP2006287169A | 2006-10-19 | |||
| JP2006073909A | 2006-03-16 | |||
| JP2001345252A | 2001-12-14 |
Attorney, Agent or Firm:
YOSHITAKE Kenji et al. (JP)
Kenji Yoshitake (JP)
Kenji Yoshitake (JP)
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