Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/044314
Kind Code:
A1
Abstract:
A substrate processing apparatus includes a rotating and holding unit, a coating liquid discharge system, a first discharge rate adjustment unit, and a second discharge rate adjustment unit. The rotating and holding unit holds and rotates a substrate in a horizontal orientation. The coating liquid discharge system discharges a coating liquid to the central portion of one surface of the substrate that is rotated by the rotating and holding unit. The first discharge rate adjustment unit adjusts the discharge rate of the coating liquid from the coating liquid discharge system to the first rate, so that the coating liquid discharged from the coating liquid discharge system to the central portion of the one surface of the substrate spreads on the one surface of the substrate within the first period. The second discharge rate adjustment unit adjusts the discharge rate of the coating liquid from the coating liquid discharge system to the second rate, which is higher than the first rate, so that the thickness of the coating liquid which has spread over the entire one surface of the substrate increases during the second period after the first period.
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Inventors:
WAJIKI TAKEHIRO (JP)
SAGAWA HIDETOSHI (JP)
SAGAWA HIDETOSHI (JP)
Application Number:
PCT/JP2018/028337
Publication Date:
March 07, 2019
Filing Date:
July 27, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/027; B05C11/08; B05C11/10; B05D1/40; B05D3/00
Foreign References:
| JP2016096345A | 2016-05-26 | |||
| JP2009207997A | 2009-09-17 | |||
| JP2009207984A | 2009-09-17 |
Attorney, Agent or Firm:
FUKUSHIMA, Yoshito (JP)
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