Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/157995
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing apparatus and a substrate processing method. The substrate processing apparatus and the substrate processing method according to the present invention have an advantage in that, in a substrate processing apparatus comprising a chamber the inner space of which is divided into a first space and a second space, a thin film having a uniform thickness can be formed on substrates placed in the first space and the second space respectively by successively spraying the substrates placed in the first and second spaces respectively with a process gas.
Inventors:
LEE JI HUN (KR)
KIM JONG SIK (KR)
KIM JONG SIK (KR)
Application Number:
PCT/KR2021/001361
Publication Date:
August 12, 2021
Filing Date:
February 02, 2021
Export Citation:
Assignee:
JUSUNG ENG CO LTD (KR)
International Classes:
C23C16/54; C23C16/455; C23C16/458; C23C16/50; C23C16/56
Foreign References:
| KR20110077743A | 2011-07-07 | |||
| KR20100005318A | 2010-01-15 | |||
| KR20070038348A | 2007-04-10 | |||
| US20070215036A1 | 2007-09-20 | |||
| JP2014201804A | 2014-10-27 |
Attorney, Agent or Firm:
KO, Yun Ho (KR)
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