Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/172064
Kind Code:
A1
Abstract:
A substrate processing apparatus comprising a holding unit, a liquid supply unit, a recovery unit, a circulation path, a gas supply unit, and a control unit. The holding unit holds a substrate. The liquid supply unit supplies a processing liquid to a first major surface of the substrate being held by the holding unit. The recovery unit recovers the processing liquid that has been used for processing the substrate. The circulation path returns the processing liquid recovered by the recovery unit back to the liquid supply unit. The gas supply unit supplies a gas to a second major surface of the substrate being held by the holding unit opposite to the first major surface. The control unit controls the liquid supply unit and the gas supply unit. The control unit, when the processing liquid planned to be returned back to the liquid supply unit by the circulation path is supplied to the first major surface, causes the gas to be supplied to the second major surface.
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Inventors:
KOSAI KAZUKI (JP)
SHINOHARA KAZUYOSHI (JP)
SHINOHARA KAZUYOSHI (JP)
Application Number:
PCT/JP2021/005413
Publication Date:
September 02, 2021
Filing Date:
February 15, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2015115409A | 2015-06-22 | |||
| JP2005217226A | 2005-08-11 | |||
| JP2007335826A | 2007-12-27 | |||
| JP2018056293A | 2018-04-05 | |||
| JPH0864568A | 1996-03-08 | |||
| JP2020004996A | 2020-01-09 | |||
| JP2018517293A | 2018-06-28 | |||
| JP2012064760A | 2012-03-29 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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