Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/047788
Kind Code:
A1
Abstract:
According to the present invention, a substrate cleaning device comprises: a substrate holding part for holding the outer peripheral end portion of a substrate; a processing part for processing the front surface or the back surface of the substrate; and a holding control part for controlling the substrate holding part so that the center portion of the substrate is displaced upwards or downwards when the substrate is being processed by the processing part.
Inventors:
TAKAHASHI TAKUMA (JP)
MURAMOTO RYO (JP)
NAKAMURA KAZUKI (JP)
CHIBA KAZUKI (JP)
MURAMOTO RYO (JP)
NAKAMURA KAZUKI (JP)
CHIBA KAZUKI (JP)
Application Number:
PCT/JP2022/028658
Publication Date:
March 30, 2023
Filing Date:
July 25, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/677
Domestic Patent References:
| WO2019176531A1 | 2019-09-19 |
Foreign References:
| JP2020102573A | 2020-07-02 | |||
| JP2009200063A | 2009-09-03 | |||
| JP2021136418A | 2021-09-13 | |||
| JP2019061996A | 2019-04-18 | |||
| JPH06151398A | 1994-05-31 |
Attorney, Agent or Firm:
NAKAGAWA, Masahiro et al. (JP)
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