Title:
SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/127493
Kind Code:
A1
Abstract:
A substrate processing apparatus (100) is equipped with a liquid delivery pipe (41), a supply pipe (43), a return pipe (44), a branching section (42), a first valve (47) and a second valve (48). The branching section (42) is the branching point between the liquid delivery pipe (41), the supply pipe (43) and the return pipe (44). The first valve (47) is provided to the liquid delivery pipe (41) and is capable of adjusting the flow of a processing liquid. The second valve (48) is provided to the return pipe (44). A discharge state for discharging the processing liquid from a drug solution nozzle (21) by causing the processing liquid to flow from the liquid delivery pipe (41) to the supply pipe (43) is attained by opening the first valve (47) and closing the second valve (48). A processing liquid return state for causing the processing liquid to flow from the supply pipe (43) to the return pipe (44) is attained by switching the second valve (48) from a closed to an open state.
Inventors:
SUGIMOTO KENTARO (JP)
YOSHIHARA NAOHIKO (JP)
YOSHIHARA NAOHIKO (JP)
Application Number:
PCT/JP2022/046002
Publication Date:
July 06, 2023
Filing Date:
December 14, 2022
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2020047884A | 2020-03-26 | |||
| JP2016063074A | 2016-04-25 | |||
| JP2018137419A | 2018-08-30 | |||
| JP2013207076A | 2013-10-07 |
Attorney, Agent or Firm:
MAEI Hiroyuki (JP)
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