Title:
SUBSTRATE PROCESSING APPARATUS, SUBSTRATE SUPPORTING TOOL, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2012/099064
Kind Code:
A1
Abstract:
Provided is a substrate processing apparatus comprising: a substrate holding base which is disposed in a substrate processing chamber, holds a substrate on a substrate holding surface, and is provided with a flange on a lateral surface thereof; a heating unit which is disposed within the substrate holding base and heats the substrate; a plurality of support pillars for supporting the flange from below; and a discharge part for discharging the inside atmosphere of the processing chamber. A support part is disposed between the substrate holding base and the plurality of support pillars.
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Inventors:
SAKATA MASAKAZU (JP)
YANAI HIDEHIRO (JP)
YANAI HIDEHIRO (JP)
Application Number:
PCT/JP2012/050729
Publication Date:
July 26, 2012
Filing Date:
January 16, 2012
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
SAKATA MASAKAZU (JP)
YANAI HIDEHIRO (JP)
SAKATA MASAKAZU (JP)
YANAI HIDEHIRO (JP)
International Classes:
H01L21/02; H01L21/31; H01L21/683; H01L21/3065
Foreign References:
| JP2001291669A | 2001-10-19 | |||
| JP2010199382A | 2010-09-09 |
Attorney, Agent or Firm:
YUI Tohru et al. (JP)
Oil well 透 (JP)
Oil well 透 (JP)
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Claims:
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