Title:
SUBSTRATE PROCESSING APPARATUS AND TEMPERATURE CONTROL METHOD USING MULTI-ZONE HEAT TRANSFER STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/277623
Kind Code:
A1
Abstract:
The present embodiments provide a substrate processing apparatus and a multi-zone temperature control method, which can facilitate the temperature control of a substrate during or after processing, wherein, by installing a multi-zone heat transfer control structure between a base structure having a refrigerant supplied thereto and the substrate, heat that can be generated between the substrate and an electrostatic chuck and the base structure or between specific structures can be blocked or transferred by using a pressure change of a heat transfer gas.
Inventors:
KWON GI CHUNG (KR)
KWON HEE TAE (KR)
KIM JI HWAN (KR)
BANG IN YOUNG (KR)
KWON HEE TAE (KR)
KIM JI HWAN (KR)
BANG IN YOUNG (KR)
Application Number:
PCT/KR2022/009453
Publication Date:
January 05, 2023
Filing Date:
June 30, 2022
Export Citation:
Assignee:
UNIV KWANGWOON IND ACAD COLLAB (KR)
International Classes:
B23Q3/15; H01L21/683; C23C16/458; H01J37/32; H01L21/67; H02N13/00; H05B3/14
Foreign References:
| KR20130049819A | 2013-05-14 | |||
| KR20200042114A | 2020-04-23 | |||
| US20210143037A1 | 2021-05-13 | |||
| KR100239389B1 | 2000-01-15 | |||
| KR20010071880A | 2001-07-31 |
Attorney, Agent or Firm:
WOOIN PATENT & LAW FIRM (KR)
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