Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/048106
Kind Code:
A1
Abstract:
This substrate processing apparatus performs electrolytic etching on the peripheral edge of a substrate (9). A first etching head (611) radially faces the peripheral edge of the substrate (9) in a part of the circumference around a rotation axis. The first etching head (611) holds an electrolytic solution (610) therein. The first etching head (611) has an insertion opening (615) into which the peripheral edge of the substrate (9) is inserted. A first head moving mechanism moves the first etching head (611) forward and backward relative to the peripheral edge of the substrate (9). An anode is in electrical contact with a conductive film (93). A cathode (66) is in electrical contact with the electrolytic solution (610). A power supply applies a voltage between the anode and the cathode (66) in a state in which the peripheral edge of the substrate (9) is inserted into the first etching head (611) through an insertion port (615) to be in contact with the electrolytic solution (610). As a result, the etching width of the conductive film (93) can be adjusted with high precision.
Inventors:
MORITA KOSEI (JP)
Application Number:
PCT/JP2023/026445
Publication Date:
March 07, 2024
Filing Date:
July 19, 2023
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/3063; C25F7/00; H01L21/304; H01L21/306
Foreign References:
| JP2021158300A | 2021-10-07 | |||
| JP2003324091A | 2003-11-14 | |||
| JPH11229199A | 1999-08-24 |
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
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