SUBSTRATE PROCESSING CONTROL SYSTEM, SUBSTRATE PROCESSING CONTROL METHOD, AND PROGRAM

WIPO Patent Application WO/2018/074091

A1

A local polishing system is provided with: a particle estimation unit (30) which estimates a film thickness distribution of a wafer; a local polishing region setting unit (11) which sets a local polishing region of the wafer on the basis of the film thickness distribution; a polishing head selection unit (12) which selects a polishing head on the basis of the size of the local polishing region; a model storage unit (20) which stores a recipe generation model that, with an attribute of the local polishing region as an input node, and a recipe for polishing processing as an output node, defines a relationship between the input node and the output node; a polishing recipe generation unit (13) which applies the attribute of the local polishing region set by the local polishing region setting unit (11) to the input node of the recipe generation model to find a polishing recipe for polishing the local polishing region; and a polishing recipe transmission unit (15) which transmits data of the polishing recipe to a local polishing module (200) for performing local polishing.

TAKEDA KOICHI (JP)
TORIKOSHI TSUNEO (JP)
OISHI KUNIO (JP)
WATANABE KATSUHIDE (JP)
YASUDA HOZUMI (JP)
ISHII YU (JP)

PCT/JP2017/032306

April 26, 2018

September 07, 2017

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EBARA CORP (JP)

B24B49/04; B24B37/005; B24B37/12; B24B49/03; B24B55/06; H01L21/304

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JP2001523586A	2001-11-27
JP2013176828A	2013-09-09
JP2003059887A	2003-02-28
JPH11251272A	1999-09-17
JP2009194134A	2009-08-27

SUZUKI, Mamoru et al. (JP)

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