Title:
SUBSTRATE PROCESSING DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2021/060140
Kind Code:
A1
Abstract:
Provided is a technology comprising a control unit for controlling a process recipe to be executed such that a substrate is processed, and a pressure controller for adjusting the opening degree of a pressure adjusting valve provided in an exhaust line of a processing chamber in which the substrate is processed, and controlling the pressure in the processing chamber, wherein: the pressure controller adjusts the opening degree of the pressure adjusting valve and outputs opening degree information to the control unit, when controlling the pressure in the processing chamber; and the control unit is configured to determine the opening or closing of the pressure adjusting valve when a preset setting value is reached, while receiving the opening degree information from the pressure controller, and monitoring the opening and closing of the pressure adjusting valve, on the basis of the opening degree information and a preset threshold value.
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Inventors:
NAKAYA KAZUO (JP)
ANDO FUMIE (JP)
NISHIURA SUSUMU (JP)
EKKO HIROSHI (JP)
ANDO FUMIE (JP)
NISHIURA SUSUMU (JP)
EKKO HIROSHI (JP)
Application Number:
PCT/JP2020/035265
Publication Date:
April 01, 2021
Filing Date:
September 17, 2020
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31; C23C16/52
Foreign References:
| JP2013168131A | 2013-08-29 | |||
| JPH05190460A | 1993-07-30 | |||
| JP2014093497A | 2014-05-19 | |||
| JP2018056157A | 2018-04-05 | |||
| JP2017155962A | 2017-09-07 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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