Title:
SUBSTRATE PROCESSING DEVICE AND METHOD FOR CONCTROLLING SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/049368
Kind Code:
A1
Abstract:
Provided is a substrate processing device in which each of a plurality of load lock chambers is disposed between a vacuum transfer chamber and an atmospheric transfer chamber, and is switched between an atmospheric ambient and a vacuum ambient. A processing unit-side transfer mechanism and a transfer unit-side transfer mechanism perform wafer transfer between the vacuum transfer chamber and the atmospheric transfer chamber via the load lock chambers. A maintenance execution unit of an overall control unit executes maintenance processing with respect to one or some of the plurality of load lock chambers. A production process control unit of the overall control unit causes the processing unit-side transfer mechanism and the transfer unit-side transfer mechanism to execute wafer transfer between the vacuum transfer chamber and the atmospheric transfer chamber using a load lock chamber which is not subject to the maintenance processing by the maintenance execution unit.
Inventors:
MORISAWA DAISUKE (JP)
Application Number:
PCT/JP2020/033011
Publication Date:
March 18, 2021
Filing Date:
September 01, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/02; H01L21/677
Domestic Patent References:
| WO2017175408A1 | 2017-10-12 |
Foreign References:
| JP2012204698A | 2012-10-22 | |||
| JP2001273336A | 2001-10-05 | |||
| JP2014090013A | 2014-05-15 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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