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Patent Searching and Data


Title:
SUBSTRATE-PROCESSING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2020/053996
Kind Code:
A1
Abstract:
Provided is a technology with which it is possible to efficiently remove foreign matter in a reaction tube. The present invention provides a feature having a substrate-holding part for holding a substrate, a reaction tube for housing the substrate-holding part and processing the substrate, a processing gas supply system for supplying a processing gas into the reaction tube, and an exhaust system for exhausting the atmosphere in the reaction tube, the substrate-holding part having a plurality of pillars for holding the substrate, a hollow part for supplying an inert gas to at least one of the pillars, and a gas supply port for supplying the inert gas to an inner wall of the reaction tube.

Inventors:
HARA DAISUKE (JP)
YAHATA TAKASHI (JP)
TAKEDA TSUYOSHI (JP)
ONO KENJI (JP)
YAMAZAKI KAZUHIKO (JP)
Application Number:
PCT/JP2018/033861
Publication Date:
March 19, 2020
Filing Date:
September 12, 2018
Export Citation:
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Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/318
Foreign References:
JP2004273605A2004-09-30
JPH05175130A1993-07-13
JPH07122507A1995-05-12
JP2009152359A2009-07-09
JPH05291240A1993-11-05
JP2010147201A2010-07-01
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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