Title:
SUBSTRATE PROCESSING DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/157967
Kind Code:
A1
Abstract:
The present invention makes it possible to: detect, with high accuracy, contact between a substrate transfer machine or a substrate on a substrate transfer machine and a boat or a substrate on a boat; and detect very small abnormalities that are present before a state of malfunction is reached. The present invention comprises: a substrate transfer machine equipped with a substrate holder for holding a substrate, an end effector for directly operating the substrate, and a drive mechanism for causing the end effector to move, the substrate transfer machine transferring the substrate to the substrate holder or transferring the substrate from the substrate holder; a vibration sensor for detecting vibration in the end effector; a control unit for controlling the substrate transfer machine; and an analysis device for using a normal space created by analyzing, through the MT method, time region data for the vibration in the end effector as detected by the vibration sensor when a substrate transfer operation by the substrate transfer machine is carried out normally, calculating the Mahalanobis distance, in the normal space, of time region data detected by the vibration sensor while the substrate transfer machine places a substrate and performs a prescribed transfer operation, and assessing that contact has been made between the end effector or the substrate on the end effector and the substrate holder or the substrate on the substrate holder when the calculated Mahalanobis distance exceeds a prescribed threshold value. The control unit outputs, to the analysis device, signals indicating the start and the end of the prescribed transfer operation.
Inventors:
OISHI MAMORU (JP)
Application Number:
PCT/JP2019/003676
Publication Date:
August 06, 2020
Filing Date:
February 01, 2019
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/677; B65G49/07
Foreign References:
| JP2001223254A | 2001-08-17 | |||
| JP2004340706A | 2004-12-02 | |||
| JPH06349930A | 1994-12-22 | |||
| JP2016014961A | 2016-01-28 |
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION IPWIN (JP)
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