Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2022/065422
Kind Code:
A1
Abstract:
Disclosed are techniques for mitigating a decrease in in-plane uniformity of a thin film produced on a substrate. This substrate processing device is provided with: a processing chamber; a processing gas supply system for supplying processing gas to the processing chamber; an evacuation system for evacuating the interior of the processing chamber; a plasma generating structure for supplying a plasma to the processing chamber; a rotating shaft having electrical conductivity and rotatably supporting a boat for holding a plurality of substrates in the processing chamber; and an internal conductor provided in the rotating shaft and electrically connected to the boat.
Inventors:
EJIRI YASUNORI (JP)
Application Number:
PCT/JP2021/035033
Publication Date:
March 31, 2022
Filing Date:
September 24, 2021
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/205; C23C16/452; C23C16/50; H01L21/31; H01L21/316; H01L21/318
Foreign References:
| JP2007531269A | 2007-11-01 | |||
| JP2008270477A | 2008-11-06 | |||
| JP2003218040A | 2003-07-31 | |||
| JP2004263292A | 2004-09-24 |
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