Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/124211
Kind Code:
A1
Abstract:
A substrate processing device 10 for cleaning a surface Wa to be cleaned of a semiconductor wafer W, wherein the substrate processing device 10 is provided with: a rotary chuck 21 capable of holding the semiconductor wafer W; a cleaning brush 41a disposed so as to face the surface Wa to be cleaned of the semiconductor wafer W held by the rotary chuck 21, the cleaning brush 41a being such that fibers of a porous fluororesin are formed in the perpendicular direction with respect to the surface of the semiconductor wafer W; a rotary motor 44 for rotationally driving the rotary chuck 21 so that the normal direction of the surface Wa to be cleaned of the substrate is the substrate rotation axis; and a nozzle tube 45 for feeding a cleaning liquid L to the surface Wa to be cleaned of the semiconductor wafer W held by the rotary chuck 21. The particle removal power is thereby increased, making it possible to use a chemical liquid as the cleaning liquid or heat the cleaning liquid, and to perform particle removal over a wide range.
Inventors:
HAMADA TAKAHIRO (JP)
HAYASHI KONOSUKE (JP)
NAGASHIMA YUJI (JP)
KAMIYAMA HIROKI (JP)
HAYASHI KONOSUKE (JP)
NAGASHIMA YUJI (JP)
KAMIYAMA HIROKI (JP)
Application Number:
PCT/JP2017/047028
Publication Date:
July 05, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
SHIBAURA MECHATRONICS CORP (JP)
CHUKOH CHEM IND (JP)
CHUKOH CHEM IND (JP)
International Classes:
H01L21/304
Foreign References:
| JP2002124504A | 2002-04-26 | |||
| JP2002066467A | 2002-03-05 | |||
| JP2002313767A | 2002-10-25 |
Attorney, Agent or Firm:
KURATA, Masatoshi et al. (JP)
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