Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/116806
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing device and a substrate processing method capable of reducing and preventing damage to an O-ring for sealing a chamber, which process a substrate by using a supercritical fluid. The substrate processing device comprises: a chamber having a chamber body, which provides a processing space in which the substrate is processed, and a chamber lid, which seals the opening of the chamber body; a fluid supply unit for supplying a main fluid to the inside of the chamber; an O-ring unit arranged between the chamber lid and the chamber body so as to seal the inside of the chamber; and a fluid supply blocking unit for providing a blocking area that blocks the connection between the O-ring unit and the processing space.
Inventors:
JU JUNG-MYOUNG (KR)
PARK SANG-JOON (KR)
OH SEUNG-MIN (KR)
LEE JOON-HEE (KR)
PARK SANG-JOON (KR)
OH SEUNG-MIN (KR)
LEE JOON-HEE (KR)
Application Number:
PCT/KR2019/015305
Publication Date:
June 11, 2020
Filing Date:
November 12, 2019
Export Citation:
Assignee:
TES CO LTD (KR)
International Classes:
H01L21/67; H01L21/02; H01L21/687
Foreign References:
KR20160053339A | 2016-05-13 | |||
KR20160135035A | 2016-11-24 | |||
KR20150073527A | 2015-07-01 | |||
US20120048304A1 | 2012-03-01 | |||
KR20130025138A | 2013-03-11 |
Attorney, Agent or Firm:
LEE, Jae-Hong (KR)
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