Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/049442
Kind Code:
A1
Abstract:
[Problem] To prevent liquid residues in the center portion of a substrate or an increase in liquid films. [Solution] This substrate processing device comprises: a substrate holding mechanism that holds a substrate; a first rotation driving part that rotates the substrate holding mechanism about a first rotation axis; and a second rotation driving part that rotates the first rotation driving part about a second rotation axis which is different from the first rotation axis and is parallel to the first rotation axis.
Inventors:
TAKAHASHI SHUHEI (JP)
OTSUKA TAKAHISA (JP)
OTSUKA TAKAHISA (JP)
Application Number:
PCT/JP2020/033699
Publication Date:
March 18, 2021
Filing Date:
September 04, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/027; H01L21/304; H01L21/683
Foreign References:
| JP2007105617A | 2007-04-26 | |||
| JP2009272493A | 2009-11-19 | |||
| JP2019102729A | 2019-06-24 |
Attorney, Agent or Firm:
NAKAMURA Yukitaka et al. (JP)
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