Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/235242
Kind Code:
A1
Abstract:
The substrate processing device according to an embodiment of the present disclosure is provided with a substrate processing unit, a processing liquid feed path (21), a mixing unit (32), a pressurization unit, and a heating unit. The substrate processing unit processes a substrate. The processing liquid feed path (21) connects a raw material liquid feed source and the substrate processing unit. The mixing unit (32) mixes ozone gas into a raw material liquid flowing in the processing liquid feed path (21). The pressurization unit is provided at a position on the processing liquid feed path (21) on the downstream side of the mixing unit (32), and pressurizes a processing liquid generated in the mixing unit (32). The heating unit is provided at a position on the processing liquid feed path (21) on the downstream side of the pressurization unit, and heats the treatment liquid.
Inventors:
IWASHITA YASUHARU (JP)
OGATA NOBUHIRO (JP)
MORIKAWA KATSUHIRO (JP)
GODA KAZUYA (JP)
KAGAWA KOJI (JP)
AMAI MASARU (JP)
SUNAKA IKUO (JP)
HACHIYA YOSUKE (JP)
FUKUDA KOSUKE (JP)
OGATA NOBUHIRO (JP)
MORIKAWA KATSUHIRO (JP)
GODA KAZUYA (JP)
KAGAWA KOJI (JP)
AMAI MASARU (JP)
SUNAKA IKUO (JP)
HACHIYA YOSUKE (JP)
FUKUDA KOSUKE (JP)
Application Number:
PCT/JP2021/017513
Publication Date:
November 25, 2021
Filing Date:
May 07, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B01F3/04; H01L21/027; H01L21/304
Domestic Patent References:
| WO2019212046A1 | 2019-11-07 |
Foreign References:
| JP2008311591A | 2008-12-25 | |||
| JPH0737797A | 1995-02-07 | |||
| JP2008016673A | 2008-01-24 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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