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Patent Searching and Data


Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/013469
Kind Code:
A1
Abstract:
A substrate processing device for irradiating a substrate with laser light and processing the substrate, the substrate processing device having a substrate holding part for holding the substrate, a laser irradiation unit for irradiating the substrate held by the substrate holding part with the laser light, and a dust collection part for collecting dust, the dust collection part having an upper dust collection part disposed above the substrate holding part, and a lower dust collection part that moves below the upper dust collection part. A substrate processing method includes: causing the substrate holding part and the lower dust collection part to move below the upper dust collection part; and suctioning the atmosphere in a space between the upper dust collection part, the substrate, and the lower dust collection part to collect dust while irradiating the substrate with the laser light from the laser irradiation unit.

Inventors:
KAWAGUCHI YOSHIHIRO (JP)
YAMAWAKI YOHEI (JP)
NAKANO SEIJI (JP)
Application Number:
PCT/JP2022/028737
Publication Date:
February 09, 2023
Filing Date:
July 26, 2022
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B23K26/16; H01L21/304
Foreign References:
JP2000343269A2000-12-12
JP2001347433A2001-12-18
JP2010120038A2010-06-03
JP2020059030A2020-04-16
JPS61182894A1986-08-15
JPH1025U1998-02-03
JPH0952189A1997-02-25
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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