SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2023/013469

A1

A substrate processing device for irradiating a substrate with laser light and processing the substrate, the substrate processing device having a substrate holding part for holding the substrate, a laser irradiation unit for irradiating the substrate held by the substrate holding part with the laser light, and a dust collection part for collecting dust, the dust collection part having an upper dust collection part disposed above the substrate holding part, and a lower dust collection part that moves below the upper dust collection part. A substrate processing method includes: causing the substrate holding part and the lower dust collection part to move below the upper dust collection part; and suctioning the atmosphere in a space between the upper dust collection part, the substrate, and the lower dust collection part to collect dust while irradiating the substrate with the laser light from the laser irradiation unit.

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KAWAGUCHI YOSHIHIRO (JP)
YAMAWAKI YOHEI (JP)
NAKANO SEIJI (JP)

PCT/JP2022/028737

February 09, 2023

July 26, 2022

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TOKYO ELECTRON LTD (JP)

B23K26/16; H01L21/304

JP2000343269A	2000-12-12
JP2001347433A	2001-12-18
JP2010120038A	2010-06-03
JP2020059030A	2020-04-16
JPS61182894A	1986-08-15
JPH1025U	1998-02-03
JPH0952189A	1997-02-25

KANEMOTO, Tetsuo et al. (JP)

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