Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/112680
Kind Code:
A1
Abstract:
This substrate processing device comprises: a substrate holding portion (5) with a suction holding face (5a) for holding a first face (2a) of a substrate (W); a processing head (7) arranged to process an outer peripheral portion of the substrate (W); a static pressure plate (9) with a fluid supporting face (9a) opposed to the suction holding face (5a); and a fluid feeding line (10) connected to the static pressure plate (9) and feeding a fluid to a space between the fluid supporting face (9a) and a second face (2b) of the substrate (W). The second face (2b) is opposite to the first face (2a) of the substrate (W). The fluid supporting face (9a) is larger than the suction holding face (5a).
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| WO/2021/175397 | BENCH GRINDER APPARATUS |
Inventors:
OHASHI HIROTAKA (JP)
Application Number:
PCT/JP2022/044173
Publication Date:
June 22, 2023
Filing Date:
November 30, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B41/06; B24B9/00; B24B21/00; B24B55/06; H01L21/304
Foreign References:
| JP2019216207A | 2019-12-19 | |||
| JP2017147334A | 2017-08-24 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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