SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2023/120229

A1

This substrate processing device comprises: a batch processing section that has a plurality of batch processing units which perform a liquid treatment on a plurality of substrates in one batch in a treatment liquid stored in a treatment tank; a single-sheet processing section that performs processing on the substrates processed in the batch processing section, one substrate at a time; a holding section that holds substrates processed by the batch processing section in an immersion liquid in an immersion tank; and a conveyance system that includes a first substrate conveyance unit which removes the substrates one at a time from the immersion liquid, and that conveys each substrate from the holding section to the single-sheet processing section. The holding section performs, on the substrates, a first liquid treatment that hydrophilizes the substrate surface or that improves or maintains the hydrophilicity of the surface, and/or a second liquid treatment that makes the zeta potential of the substrate surface negative.

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NAGAMATSU TATSUYA (JP)
INADA TAKAO (JP)
HAMASHIMA YUTA (JP)
HONDA TAKUMI (JP)
KAWANO HISASHI (JP)
KANNO ITARU (JP)

PCT/JP2022/045398

June 29, 2023

December 09, 2022

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TOKYO ELECTRON LTD (JP)

H01L21/304; H01L21/677

JP2021064652A	2021-04-22
JP2016012645A	2016-01-21
JP2020194842A	2020-12-03
JP2015026814A	2015-02-05
JP2017195416A	2017-10-26
JP2011151283A	2011-08-04

MIYAJIMA Manabu et al. (JP)

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