Title:
SUBSTRATE-PROCESSING DEVICE AND SUBSTRATE-PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/145558
Kind Code:
A1
Abstract:
This substrate-processing device comprises: a pick-up unit; a removal unit; and a mounting unit. The pick-up unit separates a chip from a tape in a state where a plurality of the chips are fitted to a frame via the tape and a protective film is formed on a first main surface of each of the chips on the side that is opposite from the tape. After the chip is separated from the tape by the pick-up unit, the removal unit removes the protective film from the chip. After the removal unit has removed the protective film, the mounting unit mounts the chip on a substrate with the first main surface of the chip facing the substrate.
Inventors:
KITANO JUNICHI (JP)
SEKIGUCHI KENJI (JP)
YONEZAWA SYUHEI (JP)
KONDO YOSHIHIRO (JP)
HAYAKAWA SUSUMU (JP)
SEKIGUCHI KENJI (JP)
YONEZAWA SYUHEI (JP)
KONDO YOSHIHIRO (JP)
HAYAKAWA SUSUMU (JP)
Application Number:
PCT/JP2023/001289
Publication Date:
August 03, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/60; H01L21/301; H01L21/304; H01L21/67
Domestic Patent References:
| WO2008146744A1 | 2008-12-04 | |||
| WO2014141514A1 | 2014-09-18 |
Foreign References:
| JP2020031174A | 2020-02-27 | |||
| JP2021190557A | 2021-12-13 | |||
| JP2014029921A | 2014-02-13 | |||
| JP2007299966A | 2007-11-15 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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