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Title:
SUBSTRATE PROCESSING DEVICE AND METHOD
Document Type and Number:
WIPO Patent Application WO/2023/167440
Kind Code:
A1
Abstract:
A substrate processing device for processing a substrate, according to one embodiment of the present disclosure, may comprise: a support unit for supporting a substrate; a fixing unit positioned at a location adjacent to a circumferential region of the substrate supported on the support unit, so as to fix the substrate; and an adsorption unit, which absorbs at the bottom surface of the substrate so as to apply force in the vertical direction to a central region of the substrate, and thus changes a warpage state of the substrate.

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Inventors:
LIM YUSEONG (KR)
Application Number:
PCT/KR2023/001592
Publication Date:
September 07, 2023
Filing Date:
February 03, 2023
Export Citation:
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Assignee:
PSK HOLDINGS INC (KR)
International Classes:
H01L21/67; H01L21/683; H01L21/687
Foreign References:
KR20200133634A2020-11-30
KR20190122281A2019-10-30
JP2014132103A2014-07-17
KR20080108274A2008-12-12
KR20140038968A2014-03-31
Attorney, Agent or Firm:
KANG, Il Shin et al. (KR)
Download PDF:
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