SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2024/009775

A1

This substrate processing device comprises: a substrate clamping unit that clamps a substrate; a supply unit the supplies a fluid to the inside of the substrate clamping unit; a suction unit that suctions the fluid from the inside of the substrate clamping unit; a first transport unit that holds the substrate from the side opposite from the substrate clamping unit; and a control unit that controls the supply unit, the suction unit, and the first transport unit. The control unit performs: control for holding the substrate that is clamped by the substrate clamping unit with the first transport unit from the side opposite from the substrate clamping unit; control for supplying a liquid to the inside of the substrate clamping unit; control for moving the first transport unit a set distance so as to separate the substrate from the substrate clamping unit by the set distance; and control for suctioning, to the inside of the substrate clamping unit, the liquid that remains between the substrate clamping unit and the substrate, in a state where the substrate is separated from the substrate clamping unit by the set distance.

KODAMA MUNEHISA (JP)
WAKAMATSU TAKAYOSHI (JP)
ZAIZEN HIROSHI (JP)

PCT/JP2023/022971

January 11, 2024

June 21, 2023

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TOKYO ELECTRON LTD (JP)

H01L21/683; B24B41/06; B24B55/06; H01L21/304

JP2015115574A	2015-06-22
JP2011091246A	2011-05-06
JP2019055436A	2019-04-11
JP2009253244A	2009-10-29
JP2016221668A	2016-12-28
JPH04267540A	1992-09-24
JP2016127195A	2016-07-11

ITOH, Tadashige et al. (JP)

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