Title:
SUBSTRATE PROCESSING DEVICE AND SCALE CORRECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/176113
Kind Code:
A1
Abstract:
Provided are a substrate processing device and a scale correction method that make it possible to ascertain an actual movement amount of a substrate even in a case where a scale has undergone thermal expansion, and to suppress degradation in positional accuracy on the substrate. More specifically, this substrate processing device comprises: a stage whereon a substrate, for which at least two reference points are set, is placed; a substrate processing unit that performs predetermined processing of the substrate placed on the stage; a movement unit that moves the substrate atop the stage and the substrate processing unit relative to each other on the basis of scale reading information; and a control device that controls said stage and said units. The substrate processing device is configured to use the control device to perform scale correction in accordance with a deviation between a set distance between the reference points set for the substrate and an actual distance between the reference points set for the substrate conveyed onto the stage.
Inventors:
SHIOTA CHIHIRO (JP)
OKAMOTO KANJI (JP)
OKAMOTO KANJI (JP)
Application Number:
PCT/JP2023/000609
Publication Date:
September 21, 2023
Filing Date:
January 12, 2023
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
B05C5/00; B05C11/10; H05K13/02
Foreign References:
| JP2019072661A | 2019-05-16 | |||
| JP2018147292A | 2018-09-20 | |||
| JP2005246123A | 2005-09-15 |
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