Title:
SUBSTRATE PROCESSING DEVICE, TEMPERATURE CONTROL PROGRAM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND TEMPERATURE CONTROL METHOD
Document Type and Number:
WIPO Patent Application WO/2022/070310
Kind Code:
A1
Abstract:
Provided is a substrate processing device comprising a cooling control unit which acquires information about the temperature of a heating unit and/or the temperature of a processing chamber, the degree of opening of a cooling valve, and an exhaust fan, and adjusts the degree of opening of the cooling valve so as to minimize an error between a predicted temperature series calculated in accordance with a prediction model and a target temperature series calculated according to the rate of change from a current target temperature to a final target temperature.
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Inventors:
YAMAGUCHI HIDETO (JP)
SHIGEMATSU SEIYA (JP)
UENO MASAAKI (JP)
SUGISHITA MASASHI (JP)
MAEDA SYUHEI (JP)
KOSUGI TETSUYA (JP)
SHIGEMATSU SEIYA (JP)
UENO MASAAKI (JP)
SUGISHITA MASASHI (JP)
MAEDA SYUHEI (JP)
KOSUGI TETSUYA (JP)
Application Number:
PCT/JP2020/037162
Publication Date:
April 07, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31
Domestic Patent References:
| WO2018100826A1 | 2018-06-07 | |||
| WO2018105113A1 | 2018-06-14 |
Foreign References:
| JP2019048322A | 2019-03-28 | |||
| JPH10193062A | 1998-07-28 | |||
| JP2019145730A | 2019-08-29 | |||
| JP2002130961A | 2002-05-09 | |||
| JPH0463276A | 1992-02-28 | |||
| JP2013062361A | 2013-04-04 | |||
| JP2012182310A | 2012-09-20 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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