Title:
SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/055835
Kind Code:
A1
Abstract:
A substrate processing device is provided with: a spin base disposed below a substrate grasped by a plurality of chuck members, the spin base transmitting the drive force of a spin motor to the chuck members; and a nozzle for supplying a processing fluid for processing the substrate to the top surface and/or bottom surface of the substrate. An IH heating mechanism of the substrate processing device has: a heat-generating member disposed between the substrate and the spin base; a heating coil disposed below the spin base; and an IH circuit for supplying electric power to the heating coil, whereby an alternating magnetic field applied to the heat-generating member is generated, and the heat-generating member is caused to generate heat.
Inventors:
SHIMAI MOTOYUKI (JP)
HAYASHI TOYOHIDE (JP)
HATANO AKITO (JP)
HAYASHI TOYOHIDE (JP)
HATANO AKITO (JP)
Application Number:
PCT/JP2017/019610
Publication Date:
March 29, 2018
Filing Date:
May 25, 2017
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/677; H01L21/304
Foreign References:
JP2016136599A | 2016-07-28 | |||
JP2007335709A | 2007-12-27 | |||
JP2003306772A | 2003-10-31 | |||
JP2001035800A | 2001-02-09 | |||
JPH11340236A | 1999-12-10 | |||
JP2002334922A | 2002-11-22 | |||
JP2015170772A | 2015-09-28 | |||
JP2014136249A | 2014-07-28 | |||
JP2015188009A | 2015-10-29 | |||
JP2011071477A | 2011-04-07 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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